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TSIII 3.0 System
TSIII BA (ETIII NH)
Conventional Implant for Restrictive Spaces
Our TSIII 3.0 Implant provides a strong, mini-solution for needing a fixture with a smaller diameter. As a member of our TS System, this implant features our Sand-blasted and Acid-etched (SA) surface, as well as our bio-compatible titanium build.
As an TSIII Implant, the 3.0 model shares many of the advantages of our award-winning TSIII SA Implant. Developed by the Osstem Implant research team, benefits of this implant and its mini-fixture include:
Extensive tests by our research and development team also demonstrate the advantage of our TSIII 3.0 Implant when compared to implants with a Resorbable Blast Media (RBM) surface:
Earlier loading times — as soon as six weeks after placing an implant — is another benefit of this implant. A self-sealing, 11-degree Morse taper connection is another feature of our TSIII 3.0 Implant that provides built-in platform switching. All our implants offer easy mastery and installation, which results in shorter surgery times.