TSIII 3.0 System

Dental Implant

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TSIII 3.0 System​

Dental Implant

TS System​

TSIII 3.0​

TSIII SA

TSIII BA (ETIII NH)

Conventional Implant for Restrictive Spaces

Our TSIII 3.0 Implant provides a strong, mini-solution for needing a fixture with a smaller diameter. As a member of our TS System, this implant features our Sand-blasted and Acid-etched (SA) surface, as well as our bio-compatible titanium build.

As an TSIII Implant, the 3.0 model shares many of the advantages of our award-winning TSIII SA Implant. Developed by the Osstem Implant research team, benefits of this implant and its mini-fixture include:

  • SA surface to provide optimal surface roughness and morphology.
  • Hermetic seal to minimise micro-movement and reduce saliva and bacteria percolation.
  • Apical design for path-correction, self-tapping and initial stability that’s secure in soft bones.
  • Corkscrew thread for aggressive self-threading and maintaining implant path.

Extensive tests by our research and development team also demonstrate the advantage of our TSIII 3.0 Implant when compared to implants with a Resorbable Blast Media (RBM) surface:

  • A 45 percent improvement in the surface area.
  • A 20 percent decrease in bone healing times.
  • A 20 percent decrease in cell response times.

Earlier loading times — as soon as six weeks after placing an implant — is another benefit of this implant. A self-sealing, 11-degree Morse taper connection is another feature of our TSIII 3.0 Implant that provides built-in platform switching. All our implants offer easy mastery and installation, which results in shorter surgery times.